NDLI: Dicing of optical wafer level packages

Content Provider	IEEE Xplore Digital Library
Author	Tangaha, D. Bieck, F.
Copyright Year	2006
Description	Author affiliation: SCHOTT Adv. Packaging Singapore Pte Ltd. (Tangaha, D.; Bieck, F.)
Abstract	The optical wafer level packaging, developed by Schott Advanced Packaging, consists of a Silicon wafer, comprising the optical sensors, which is bonded to a glass wafer in the very first process step to protect the sensors. The package utilizes a via through contact through the Silicon by contacting the bond pads of the image sensor from the backside. By this approach, a package for optical sensors that is manufactured has virtually the same lateral dimensions as the image sensor by itself (Leib and Topper, 2004) and (Viswanadam, et. al., 2005). As typical for any wafer level packaging application, the last step of the manufacturing flow is the singulation of the Si-Glass compound using a standard dicing saw for board assembly of the chips. Depending on the specific process flow of the SCHOTT opto package, the final dicing has to be performed either through a Si-glass compound, or only through the glass. Both approaches have their benefits and trade-offs under design and manufacturability point of view. This paper describes the effects of glass and silicon thickness and dicing speeds on dicing of glass-silicon bonded wafers without dicing streets. The study compares various glass and silicon thickness and cutting speeds and observing their impacts to sidewall cracks/chipping
Starting Page	260
Ending Page	264
File Size	550076
Page Count	5
File Format	PDF
ISBN	1424406641
DOI	10.1109/EPTC.2006.342726
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-12-06
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Wafer scale integration Packaging Optical sensors Silicon Glass Wafer bonding Manufacturing Image sensors Protection Assembly
Content Type	Text
Resource Type	Article

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