NDLI: On the study of loop profiles in improving the sweep stiffness of wire bond

Content Provider	IEEE Xplore Digital Library
Author	Kung, H.K. Huang, C.H. Chanyshev, A.I.
Copyright Year	2006
Description	Author affiliation: Graduate Inst. of Mechatronic Eng., Cheng Shiu Univ., Kaohsiung (Kung, H.K.; Huang, C.H.)
Abstract	The deflection of gold wire bonds during the encapsulation of IC packaging can seriously cause wire crossover and shorting. Up to now, there is no (standard) algorithm has been proposed to decide the better bond looping system for optimal adjusting the parameters of wire bonder to obtain lower deflection of wire bond. The wire sweep experiment is developed to define the sweep stiffness of wire bond in the related studies. The sweep stiffness of wire bond is defined to be the index of sweep resistance to drag force during the transfer molding process. Higher sweep stiffness of wire bond possesses lower wire sweep and thereby higher yield rate of IC packaging. The sweep stiffness of three bond modes, Q-loop, S-loop and M-loop bonds is studied in this paper. The results show the Q-loop bond has the highest sweep stiffness values than those of the S-loop and M-loop bonds for fixed bond spans and bond heights. The sweep stiffness of S-loop and M-loop bonds, mostly used for longer connections or crossing another chip in multichip module/3-dimensional packages has found to be affected significantly by their kinking numbers within a bond. The experimental results points out that the M-loop bond has better sweep resistance than the S-loop bond does. The increment in the sweep stiffness could be up to 13-75% depend on the bond span and bond height used.
Starting Page	472
Ending Page	477
File Size	228720
Page Count	6
File Format	PDF
ISBN	1424406641
DOI	10.1109/EPTC.2006.342759
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-12-06
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Wire Gold Electronics packaging Bonding forces Transfer molding Equations Semiconductor device packaging Integrated circuit modeling Integrated circuit packaging Drag
Content Type	Text
Resource Type	Article

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The analysis of the bending and twisting moments induced sweep deflection for semiconductor package applications

Wire sweep during molding of integrated circuits

The Improvement of Sweep Stiffness and Thermomechanical Properties of Wire Bonds for Pure Gold Wire with Dopant

Simulation of three-dimensional wirebond deformation during transfer molding

The application of mold flow simulation in electronic package

The equivalent diameter of copper wire and gold wire based on the sweep stiffness evaluation in semiconductor packaging

The effects of die thickness and bond height on wire sweep in multi-chip module and 3-Dimennsional packages

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