NDLI: Improvement of drop reliability in OSP/Cu pad finished packages

Content Provider	IEEE Xplore Digital Library
Author	Pyoung-Wan Kim Bo-Seong Kim Eun-Chul Ahn Tae-Gyeong Chung
Copyright Year	2006
Description	Author affiliation: Memory Div., Samsung Electron., Seoul (Pyoung-Wan Kim)
Abstract	This study investigated the improvement of drop reliability of OSP (organic solderability preservatives) pad finished packages having half etched solder ball pads. Besides the effect of the Cu pad etching depth, effects of other factors such as solder composition or reflow peak temperature on drop reliability were examined by the bending impact test and drop test. The bending impact test results showed that the increase of etching depth at the solder ball pad increased the drop reliability because of the fracture mode transition from solder/pad interface failure to solder bulk failure, but that the increase of reflow peak temperature decreased the drop reliability. The drop test results showed that the increase of the etching depth at the solder ball pad increased the drop reliability without the fracture mode transition, and that the change of the solder composition from Sn3.0Ag0.5Cu to Sn1.2Ag0.5Cu0.05Ni increased the drop reliability and shifted the fracture mode from interface failure to the bulk failure. The optimal conditions for the drop reliability improvement are presented in terms of the etching depth at the solder ball pad, the reflow peak temperature, and the solder composition.
Starting Page	168
Ending Page	173
File Size	959376
Page Count	6
File Format	PDF
ISBN	1424406641
DOI	10.1109/EPTC.2006.342710
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-12-06
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Testing Etching Temperature Electronics packaging Consumer electronics Gold Semiconductor device reliability Semiconductor device packaging Soldering Vehicles
Content Type	Text
Resource Type	Article

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