NDLI: Emerging From Lab to LAP: Development of Large Area Processing Technologies for Low-Cost Photonic Interconnects on PCBs

Content Provider	IEEE Xplore Digital Library
Author	Immonen, M. Tian, D. Junnila, S. Tarja Rapala-Virtaneir
Copyright Year	2006
Description	Author affiliation: Aspocomp Oy, Espoo (Immonen, M.)
Abstract	We have studied and developed technologies to embedded high-speed optical interconnects on printed circuit boards (PCB). In this paper, we show results of fabricating optical-PCBs on a production scale panels in a modern high-density interconnect-PCB (HDI-PCB) process environment. Impacts on board design and manufacturing are studied with the developed optical technology verifiers. One verifier is an optical-PCB with 3D optical routings realized with embedded waveguides, integrated i/o couplers and optical vias. Another one is a system level optical board assembly (O-PCB-A) with 10 Gb/s Tx/Rx devices on surface mounted ball grid array (BGA) modules implemented for optical link analysis. Fabricated boards are characterized of their functionality, physical characteristics and optical alignment throughout the critical optical path. Based on the results, capabilities of a modern production infrastructure to fabricate optical-PCBs and board assemblies are discussed. Focus in the analysis is on manufacturability and on factors affecting functionality, performance and yield
Sponsorship	IEEE CPMT
Starting Page	1347
Ending Page	1355
File Size	10706827
Page Count	9
File Format	PDF
ISBN	1424405521
DOI	10.1109/ESTC.2006.280186
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-09-05
Publisher Place	Germany
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Integrated optics Optical interconnections Optical design Printed circuits Integrated circuit interconnections Production Manufacturing High speed optical techniques Optical waveguides Photonics
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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