NDLI: Surface mountable low cost packaging for RFID device

Content Provider	IEEE Xplore Digital Library
Author	Lim, S.Y.L. Ser Choong Chong Lihui Guo Wai Yin Hnin
Copyright Year	2006
Description	Author affiliation: Inst. of Microelectron., Singapore (Lim, S.Y.L.; Ser Choong Chong; Lihui Guo; Wai Yin Hnin)
Abstract	Radio frequency identification (RFID) is quickly gaining a foothold in the identification and security industry. It is used in areas of healthcare, cashless ticketing system, inventory management and security identification. However one critical roadblock that prevents companies in adopting RFID technologies is the manufacturing cost with assembly cost as the main contributing factor. One approach to reduce the assembly cost is using surface mount technology. Currently anisotropic conductive adhesives (ACA) and non-conductive adhesives (NCA) are being used for RFID flip chip assembly. However these two approaches only permit series assembly which result in higher assembly time as compared to surface mount device using ICA which allows batch screen printing. Isotropic conductive adhesives (ICA) joints however have a more sensitive affect from moisture and mechanical stress. Therefore in this paper, ultra-violet (UV) epoxy was used to encapsulate the chip that had been surface mounted onto the substrate so as to increase the mechanical strength of the ICA and also to reduce the exposure to moisture which degrades the joints. Epoxy that needed only UV curing offered additional benefit of its quick curing characteristic. Two test vehicles, daisy chain sample and active circuitry chip, were fabricated and mounted on polymer substrate. Both vehicles performed well in reliability tests and active tests on detection distance
Starting Page	255
Ending Page	259
File Size	332006
Page Count	5
File Format	PDF
ISBN	1424406641
DOI	10.1109/EPTC.2006.342725
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-12-06
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Costs Packaging Radiofrequency identification Assembly Circuit testing Independent component analysis Security Conductive adhesives Moisture Curing
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in