NDLI: Characterization of viscoelastic behaviour of a molding compound with application to delamination analysis in IC packages

Content Provider	IEEE Xplore Digital Library
Author	Gojun Hu Tay, A.A.O. Yongwei Zhang Wenhui Zhu Chew, S.
Copyright Year	2006
Description	Author affiliation: Cookson Semicond. Packaging Mater., Singapore (Gojun Hu)
Abstract	Over the glass transition temperature, molding compounds strongly exhibit viscoelastic behavior which causes their Young's moduli to be not only temperature-dependent but also time-dependent. In the present study, the stress relaxation test is used for the characterization of the viscoelasticity of an epoxy molding compound. The viscoelastic properties of the epoxy molding compound are determined in terms of Prony coefficients, relaxation time and time-temperature shift factors. Furthermore, the effect of viscoelasticity on the delamination in IC packaging is investigated
Starting Page	53
Ending Page	59
File Size	380338
Page Count	7
File Format	PDF
ISBN	1424406641
DOI	10.1109/EPTC.2006.342690
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-12-06
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Viscosity Elasticity Delamination Application specific integrated circuits Integrated circuit packaging Materials testing Capacitive sensors Integrated circuit modeling Thermal stresses Temperature
Content Type	Text
Resource Type	Article

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Characterization of viscoelastic behaviour of a molding compound with application to delamination analysis in IC packages