NDLI: Experimental and numerical assessment of board-level temperature cycling performance for PBGA, FBGA and CSP

Content Provider	IEEE Xplore Digital Library
Author	Wei Sun Zhu, W.H. Che, F.X. Wang, C.K. Sun, A.Y.S. Tan, H.B.
Copyright Year	2006
Description	Author affiliation: United Test & Assembly Center Ltd., Packaging Anal. & Design Center, Singapore (Wei Sun; Zhu, W.H.; Che, F.X.; Wang, C.K.; Sun, A.Y.S.; Tan, H.B.)
Abstract	This paper examines the board-level solder joint reliability of PBGA, FBGA and CSP packages under temperature cycling (TC) condition, both experimentally and numerically. 11 legs of test vehicles including 2 legs of PBGA, 2 legs of FBGA, 2 legs of two-die CSP and 5 legs of single-die CSP, were assembled with different solder ball sizes, mold compound materials, test board thickness, and solder materials, i.e., eutectic Pb-Sn and Sn3Ag0.5Cu. Those assemblies were subject to TC condition using UTAC internal TC chamber and data collection system. Two TC conditions were used, which are -40degC~125degC with 15mins ramp/dwell (TCI) and 0degC~100degC with 10mins ramp/dwell (TC2). For the numerical study, Darveaux's approach, which uses Anand's visco-plasticity constitutive model plus fracture mechanics based fatigue model, was used for legs with eutectic 62Sn36Pb2Ag solders; while for Pb-free legs, various publicly available Pb-free constitutive and fatigue models were applied to evaluate their prediction capability.
Starting Page	121
Ending Page	126
File Size	797378
Page Count	6
File Format	PDF
ISBN	1424406641
DOI	10.1109/EPTC.2006.342702
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-12-06
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Temperature Leg Chip scale packaging Predictive models Materials testing Joining materials Fatigue Soldering Materials reliability Vehicles
Content Type	Text
Resource Type	Article

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