NDLI: Buckling driven interface delamination between a thin metal layer and a ceramic substrate

Content Provider	IEEE Xplore Digital Library
Author	Liu, C.J. Zhang, G.Q. Ernst, L.J. Vervoort, M. Wisse, G.
Copyright Year	2001
Description	Author affiliation: Delft Univ. of Technol., Netherlands (Liu, C.J.)
Abstract	Interface delamination failure caused by thermomechanical loading and mismatch of thermal expansion coefficients is one of the important failure modes occurring in electronic packages, thus a threat for package reliability. To solve this problem, both academic institutions and industry have been spending tremendous research effort in order to understand the inherent failure mechanisms and to develop advanced and reliable experimental and simulation methodologies, thus to be able to predict and to avoid interface delamination before physical prototyping. Various damage mechanisms can be involved and can result into interface delamination phenomena. These are not all sufficiently addressed and/or reported so far, probably because of the complexities caused by the occurrence of strong geometric- and material nonlinearities. One of the phenomena being insufficiently understood so far is the so-called buckling driven delamination of thin metallic layers on ceramic substrates. This phenomena is discussed in the present paper.
Sponsorship	Components, Packaging, & Manuf. Technol. (CPMT) Soc. IEEE
Starting Page	624
Ending Page	631
File Size	297131
Page Count	8
File Format	PDF
ISBN	0780370384
ISSN	05695503
DOI	10.1109/ECTC.2001.927794
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2001-05-29
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Delamination Ceramics Copper Electronic packaging thermal management Computational modeling Substrates Thermal loading Solid modeling Residual stresses Thermomechanical processes
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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