NDLI: Influence of Interfacial Compliance on Thermomechanical Stresses in Multilayered Microelectronic Packaging

Content Provider	IEEE Xplore Digital Library
Author	Basaran, C. Yujun Wen
Copyright Year	1999
Abstract	Many analytical procedures are proposed for thermomechanical analysis of layered structures, mostly based on the perfectly bonded interfacial conditions. However, in the microelectronics industry, there is a strong desire to design packages with flexible interfaces to decrease interfacial stresses and interfacial delamination. In this paper, an analytical model based on flexible interfacial compliances is presented for multilayered microelectronic structures where loading can be a thermal gradient across the layers rather than uniform temperature. Interfacial stresses and the normal stresses in the layers can be calculated very efficiently and quickly compared to time-consuming finite-element analysis and following asymptotic analysis. The influence of interfacial compliance on thermomechanical stresses is investigated for different cases
Sponsorship	IEEE Components, Packaging, and Manufacturing Technology Society IEEE Components, Packaging and Manufacturing Technology Society
Starting Page	666
Ending Page	673
Page Count	8
File Size	506330
File Format	PDF
ISSN	15213323
Volume Number	29
Issue Number	4
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-11-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Thermomechanical processes Thermal stresses Microelectronics Packaging Bonding Delamination Analytical models Thermal loading Temperature Finite element methods laminated substrate Adhesive delamination electronic packaging
Content Type	Text
Resource Type	Article
Subject	Electrical and Electronic Engineering

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