NDLI: Experimental investigation of time dependent degradation of coupling agent bonded interfaces

Content Provider	IEEE Xplore Digital Library
Author	Leung, S.Y.Y. Lam, D.C.C. Wong, C.P.
Copyright Year	2001
Description	Author affiliation: Dept. of Mech. Eng., Hong Kong Univ. of Sci. & Technol., China (Leung, S.Y.Y.)
Abstract	Moisture induced delamination between plastic encapsulant and substrate may lead to damage of interconnect and corrosion of metallic components. Coupling agents are widely used as additives in epoxy based encapsulants to improve the adhesive strength by introducing chemical bonding across the interface. The stability of the interfacial bonds is affected by the presence of active chemicals and stresses. Coupling agent chemistry, pH, temperature, and stresses have been observed to affect the rate of adhesion strength degradation and jeopardize the long-term reliability of packages. In this study, the subcritical interfacial debonding process under controlled chemical environment and stresses were quantified. Debonding rate of underfill adhesives with silane coupling agent, titanate coupling agent, and zirconate coupling agent were characterized by the shear fracture tests and the tapered double cantilever beams test under varied temperatures, pHs, and loadings. An analytical procedure was developed to delineate the kinetic parameters of gradual debonding. The implications of the results on subcritical failures of interfacial bonds were discussed with respect to material selection criteria and electronic package reliability.
Sponsorship	Components, Packaging, & Manuf. Technol. (CPMT) Soc. IEEE
Starting Page	1333
Ending Page	1337
File Size	220935
Page Count	5
File Format	PDF
ISBN	0780370384
ISSN	05695503
DOI	10.1109/ECTC.2001.928004
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2001-05-29
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Degradation Stress Optical coupling Chemicals Temperature Packaging Testing Moisture Delamination Plastics
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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