NDLI: On the effect of system constraints on mechanical integrity of high density packages used in telecommunication applications

Content Provider	IEEE Xplore Digital Library
Author	Langari, A.R. Morris, W.L. Kuhlman, M. Hashemi, H.S. Dadkhah, M.S.
Copyright Year	2001
Description	Author affiliation: Dept. of Adv. Packagin, Mindspeed Technol. Inc., Newport Beach, CA, USA (Langari, A.R.)
Abstract	A system level mechanical analysis was performed to optimize the mechanical integrity of a high-density MCM package, employing ball grid array technology, and being used in a telecommunications application. Post manufacturing processes in addition to the system constraints can affect the mechanical integrity of packages already qualified at the component level. The prediction of these large-scale effects and integrating the new insights into the package design guidelines is very important in achieving applications reliability. We have fully analyzed the system behavior of a test structure intended for a high-density telecommunication application. The analysis activities were accelerated using highly integrated internally developed codes, compatible with commercial finite-element-analysis tools. The study included a set of experimental test structures, and a full set of system validation experiments. In this paper, we present the results of this study which proposes a system analysis methodology along with describing the related analysis results, covering the effect of a large set of design parameters effecting the mechanical integrity of the package. These results and methods are being used for design optimization analysis at Mindspeed Technologies Inc.
Sponsorship	Components, Packaging, & Manuf. Technol. (CPMT) Soc. IEEE
Starting Page	264
Ending Page	269
File Size	849169
Page Count	6
File Format	PDF
ISBN	0780370384
ISSN	05695503
DOI	10.1109/ECTC.2001.927733
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2001-05-29
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	System testing Performance analysis Electronics packaging Components, packaging, and manufacturing technology Manufacturing processes Large scale integration Guidelines Acceleration Finite element methods Design optimization
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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