NDLI: A silicon optical bench approach to low cost high speed transceivers

Content Provider	IEEE Xplore Digital Library
Author	Goodrich, J.
Copyright Year	2001
Description	Author affiliation: M/A-COM, Burlington, MA, USA (Goodrich, J.)
Abstract	In order to meet the increasing demand for bandwidth at reduced cost, new optical subassemblies must meet the critical demands of high data rate, 2.5-10 Gbit/s and a package amenable to high-volume and low cost production. Current approaches utilizing laser mounting to header assemblies with active laser alignment to outgoing optical fibers fail on both accounts. In response to this, the work described here details the development of a passively aligned silicon wafer board package capable of rates of 10 Gb/s and higher. Results show that through careful design and process control, single crystal silicon substrates containing passive alignment features (e.g., v-grooves, fiducial markings, etc.) can be reproducibly fabricated with sub-micron dimensional accuracies. The processing of the silicon wafer board and initial assembly of the components will be presented.
Sponsorship	Components, Packaging, & Manuf. Technol. (CPMT) Soc. IEEE
Starting Page	238
Ending Page	241
File Size	919845
Page Count	4
File Format	PDF
ISBN	0780370384
ISSN	05695503
DOI	10.1109/ECTC.2001.927729
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2001-05-29
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Silicon High speed optical techniques Costs Packaging Fiber lasers Assembly Bandwidth Production Optical fibers Process design
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Low cost CWDM optical transceivers

Small form factor: higher density for fiber based high speed networking

Hewlett Packard singlemode Small Form Factor (SFF) module incorporates micromachined silicon, automated passive alignment, and non-hermetic packaging to enable the next generation of low-cost fibre optic transceivers

Low-Cost Radio-over-Fiber links

Progress towards low-cost modules for SMT

Low power consumption molded gigabit fiberoptic transceiver module

Non-hermetic techniques for low cost, high performance, opto-electronic component assembly

Silicon Waferboard: Challenges And Opportunities For Low-cost Optoelectronic Subsystems

Development of Optical Subassembly for Plastic Optical Fiber Transceiver in High-Speed Applications

A silicon optical bench approach to low cost high speed transceivers

Similar Documents

Low cost CWDM optical transceivers

Small form factor: higher density for fiber based high speed networking

Hewlett Packard singlemode Small Form Factor (SFF) module incorporates micromachined silicon, automated passive alignment, and non-hermetic packaging to enable the next generation of low-cost fibre optic transceivers

Low-Cost Radio-over-Fiber links

Progress towards low-cost modules for SMT

Low power consumption molded gigabit fiberoptic transceiver module

Non-hermetic techniques for low cost, high performance, opto-electronic component assembly

Silicon Waferboard: Challenges And Opportunities For Low-cost Optoelectronic Subsystems

Development of Optical Subassembly for Plastic Optical Fiber Transceiver in High-Speed Applications

A silicon optical bench approach to low cost high speed transceivers