NDLI: Microwave cure of metal-filled electrically conductive adhesive

Content Provider	IEEE Xplore Digital Library
Author	Tiebing Wang Ying Fu Becker, M. Liu, J.
Copyright Year	2001
Description	Author affiliation: Dept. of Production Eng., Chalmers Univ. of Technol., Goteborg, Sweden (Tiebing Wang)
Abstract	Microwave (MW) as a heating source to cure polymer and polymer-based composites significantly speeds up the curing process. Electrically conductive adhesive (ECA), however, normally excludes the use of MW because of the possible arcing effect when metal particles are exposed to MW. A new technology named Variable Frequency Microwave (VFMW) has been recently developed, with which the arcing effect is avoided, thus providing us with a rapid process for curing ECA. In this paper, several adhesive samples were cured with VFMW. We have analyzed the effect of polymer material, the percentage of the metal particles in the ECAs, geometric size and shape of the metal particles, as well as the physical parameters of the VFMW on the heating rate. Both experimental and theoretical result have demonstrated that the VFMW technology is applicable in curing the electrically conductive adhesives.
Sponsorship	Components, Packaging, & Manuf. Technol. (CPMT) Soc. IEEE
Starting Page	593
Ending Page	597
File Size	630116
Page Count	5
File Format	PDF
ISBN	0780370384
ISSN	05695503
DOI	10.1109/ECTC.2001.927789
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2001-05-29
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Conductive adhesives Electromagnetic heating Polymers Microwave technology Frequency Curing Microwave ovens Electronic packaging thermal management Conducting materials Cogeneration
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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