NDLI: Mold delamination and die fracture analysis of mechatronic packages

Content Provider	IEEE Xplore Digital Library
Author	Mercado, L.L. Wieser, H. Hauck, T.
Copyright Year	2001
Description	Author affiliation: Interconnect Syst. Lab., Tempe, AZ, USA (Mercado, L.L.)
Abstract	Multichip Mechatronic Power Packages have been developed in Motorola for automotive applications. Copper heat sink-based metal substrates were used to improve thermal and electrical performance. In the early stage of development, mold delamination and die cracking have been observed after assembly. With some mold compound, die backside has large delaminated areas, while with other mold compound, delamination stops early but die cracks. Finite element analysis, incorporated with interface fracture mechanics method, was conducted to understand these phenomena. Impact of mold material properties and package geometry on post-assembly delamination was evaluated. Excellent agreements have been obtained between experimental data and the simulation results. The phenomenon of crack branching into the die was also studied. Finite element simulation can be used to predict whether and when the crack at the interface will turn and crack the die. With a thorough understanding of the failure mechanism, both mold delamination and die cracks have been eliminated completely in the final package development.
Sponsorship	Components, Packaging, & Manuf. Technol. (CPMT) Soc. IEEE
Starting Page	903
Ending Page	910
File Size	586977
Page Count	8
File Format	PDF
ISBN	0780370384
ISSN	05695503
DOI	10.1109/ECTC.2001.927902
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2001-05-29
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Delamination Mechatronics Packaging Finite element methods Automotive applications Copper Resistance heating Heat sinks Assembly Material properties
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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