NDLI: Self-alignment feasibility study and contact resistance improvement of electrically conductive adhesives (ECAs)

Content Provider	IEEE Xplore Digital Library
Author	Jiali Wu Kyoung-Sik Moon Wong, C.P.
Copyright Year	2001
Description	Author affiliation: Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA (Jiali Wu)
Abstract	With the driving force of "green" revolution in electronics industry, tremendous efforts have been put on looking for lead-free alternatives. Although lead-free alloys draw a lot of attention, their parasitic weaknesses, such as high processing temperature and surface tension, limit their application on thermally sensitive, flexible, non-solderable substrates and ultra-fine pitch size flip chip interconnection. Conventional electrically conductive adhesives (ECAs) have been widely used in surface mount and die-attach technologies for electrical interconnection and heat dissipation. Low processing temperature of ECAs is one of the major advantages over lead-free solders, which brings low system stress, simple manufacture process and the like. In order to improve the contact resistance of ECAs, the low melting point alloy (LMA) incorporating technology had been developed by our group. In this paper, the research thrust was concentrated on the LMA depletion method since re-melting LMA in ECAs can adversely affect the physical property. A differential scanning calorimeter (DSC) was used for the basic examination of depleting rate of LMAs in the typical ECAs. Cross-sectional morphology was investigated by scanning electron microscopy. A new curing process was designed to deplete the LMA in ECAs. Providing enough time for LMA to wet on the surface of silver and metal pad could improve the contact resistance on non-noble metal pad during high temperature and humidity test.
Sponsorship	Components, Packaging, & Manuf. Technol. (CPMT) Soc. IEEE
Starting Page	571
Ending Page	575
File Size	1142460
Page Count	5
File Format	PDF
ISBN	0780370384
ISSN	05695503
DOI	10.1109/ECTC.2001.927785
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2001-05-29
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Contact resistance Environmentally friendly manufacturing techniques Lead Temperature sensors Surface morphology Surface resistance Electronics industry Surface tension Flip chip Conductive adhesives
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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