NDLI: Parameterized models for a RF chip-to-substrate interconnect

Content Provider	IEEE Xplore Digital Library
Author	Doerr, I. Lih-Tyng Hwang Sommer, G. Oppermann, H. Li, L. Petras, M. Korf, S. Sahli, F. Myers, T. Miller, M. John, W.
Copyright Year	2001
Description	Author affiliation: Fraunhofer-IZM, Berlin, Germany (Doerr, I.)
Abstract	Skyrocketing growth in the cellular personal communications services (PCS) sector has fueled the needs for higher density, more functionality, and greater performance on both handset and base stations. Third generation wireless standards, which require hardware upgrades, loom on the horizon. RF component suppliers are scrambling to find solutions at the IC, package, and PCB levels to meet these challenges. RF module packaging is considered as one of the low cost solutions for the future wireless products. One of the critical design needs for RF interconnects is to understand the electrical performance of wire bond (the RF interconnect of choice) at and above frequency of interest, and to determine the performance limit for the wire bond chip-to-substrate interconnect. The availability of design kit or library would result in a substantial reduction in design cycle times. Using wire bond as example, this paper illustrates the developmental stages that turn electromagnetic characteristics of a physical structure into a design library. Fullwave simulation using Ansoft HFSS and compact models extraction using optimization tool for wire bond are shown, followed by in-depth discussions of wire bond parameterized models. Validation of parameterized model by measurement is presented.
Sponsorship	Components, Packaging, & Manuf. Technol. (CPMT) Soc. IEEE
Starting Page	831
Ending Page	838
File Size	774324
Page Count	8
File Format	PDF
ISBN	0780370384
ISSN	05695503
DOI	10.1109/ECTC.2001.927883
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2001-05-29
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Radio frequency Wire Bonding Personal communication networks Packaging Libraries Telephone sets Base stations Hardware Radiofrequency integrated circuits
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

3 V GSM base station RF receivers using 0.25 /spl mu/m BiCMOS

Comparative studies on interconnect techniques for RF applications

RF SiP technology innovation through integration

Parameterized models for a rf chip-to-substrate interconnect.

A cellular band personal communication system

A 2.7 V GSM RF transceiver IC

A base-band to RF BiCMOS transmitter RFIC for dual-band CDMA/AMPS wireless handsets

Parasitic-aware design and optimization of CMOS RF integrated circuits

Parasitic-aware design and optimization of CMOS RF integrated circuits

Parameterized models for a RF chip-to-substrate interconnect

Similar Documents

3 V GSM base station RF receivers using 0.25 /spl mu/m BiCMOS

Comparative studies on interconnect techniques for RF applications

RF SiP technology innovation through integration

Parameterized models for a rf chip-to-substrate interconnect.

A cellular band personal communication system

A 2.7 V GSM RF transceiver IC

A base-band to RF BiCMOS transmitter RFIC for dual-band CDMA/AMPS wireless handsets

Parasitic-aware design and optimization of CMOS RF integrated circuits

Parasitic-aware design and optimization of CMOS RF integrated circuits

Parameterized models for a RF chip-to-substrate interconnect