NDLI: Flip-chip assembly development via modified reflowable underfill process

Content Provider	IEEE Xplore Digital Library
Author	Ping Miao Yixin Chew Tie Wang Foo, L.
Copyright Year	2001
Description	Author affiliation: Questech Solutions Pte. Ltd., Singapore, Singapore (Ping Miao)
Abstract	This paper presents two flip-chip assembly processes that enable an underfill with higher filler loading to be incorporated into the package. The first process includes dispensing the underfill containing higher filler loading on substrate surface, followed by chip placement and solder reflow under thermal compression. Apart from this, the second approach is virtually the modification of standard reflowable underfill process. The underfill with higher filler loading was spin-coated onto a bumped wafer surface and then cured. Subsequently, the top portion of bumps was exposed by laser treatment prior to wafer dicing. The diced chips with low CTE coating on the surface already were assembled via standard reflowable underfill process that includes dispensing reflowable underfill, chip placement and solder reflow through reflow oven.
Sponsorship	Components, Packaging, & Manuf. Technol. (CPMT) Soc. IEEE
Starting Page	174
Ending Page	180
File Size	1180374
Page Count	7
File Format	PDF
ISBN	0780370384
ISSN	05695503
DOI	10.1109/ECTC.2001.927714
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2001-05-29
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Assembly Curing Silicon compounds Packaging Testing Instruments Surface treatment Coatings Thermomechanical processes Wafer scale integration
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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