NDLI: Embedded TiNxOy thin-film resistors in a build-up CSP for 10 Gbps optical transmitter and receiver modules

Content Provider	IEEE Xplore Digital Library
Author	Shibuya, A. Matsui, K. Takahashi, K. Kawatani, A.
Copyright Year	2001
Description	Author affiliation: Functional Devices & Mater. Res., NEC Corp., Kawasaki, Japan (Shibuya, A.)
Abstract	Integral passive components provide efficient circuit miniaturization while maintaining high performance and reducing assembly costs. The development of practical integral passive components, however, requires advances in the areas of materials, low-cost processes, and structural design. We have developed new TiNxOy thin-film resistors, as well as a termination resistor-embedded CSP, and a process for fabricating integral passive components. Our TiNxOy films exhibit a sheet resistivity in the range of 30-5 k 22/square. To keep costs low, we have made the fabrication process compatible with that for MCM-D/L. Resistors as small as 25 /spl mu/m square have been successfully produced with this process. The Chip Scale Package (CSP) with embedded resistors has been designed for 10 Gbps optical transmitter and receiver modules. A fabricated version shows excellent return loss for its termination resistor, less than -20 dB in the frequency range of 50 MHz -14 GHz, and its resistors performed high reliability in constant voltage stress tests, with less than 5% change in resistance at 800 mW/mm/sup 2/ over 1000 hours.
Sponsorship	Components, Packaging, & Manuf. Technol. (CPMT) Soc. IEEE
Starting Page	847
Ending Page	851
File Size	786450
Page Count	5
File Format	PDF
ISBN	0780370384
ISSN	05695503
DOI	10.1109/ECTC.2001.927888
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2001-05-29
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Transistors Resistors Thin film circuits Costs Chip scale packaging Assembly Sheet materials Process design Conductivity Optical device fabrication
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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