NDLI: Development of highly reliable CSP

Content Provider	IEEE Xplore Digital Library
Author	Yamaji, Y. Juso, H. Ohara, Y. Matsune, Y. Miyata, K. Sota, Y. Narai, A. Kimura, T. Fujita, K. Kada, M.
Copyright Year	1997
Description	Author affiliation: VLSI Dev. Lab., Sharp Corp., Nara, Japan (Yamaji, Y.)
Abstract	High density packages are demanded due to recent miniaturization for personal tools. In order to satisfy these demands, development is being done in various companies in CSP (Chip-Size-Package or Chip-Scale-Package) in which its package size in nearly the same as LSI chip and function is close to bare chip. We have developed and mass production of CSP using current equipment based on a proven packaging technology involving wire bonding and transfer mold technology. We can realize 0.8 mm terminal pitch and from the memory with a few to ASIC with 300 in pin counts using this technology and correspond to various matrix layout independent of LSI chip size. The CSP developed by us uses polyimide with one side pattern. After mounting the LSI chip and connecting with wire bonding, one side is contained with mold resin. External terminals use solder ball which is of area array structure. In order to minimize the outline size of the package to be as close to the LSI chip as possible, various technologies were developed such as ultra-short loop wire bonding technology of a half length compared to conventional loop length, super-small solder ball mounting technology how far size of 0.3 mm /spl phi/, low stress high precision cutting technology with laser and fine pattern technology of substrate. Furthermore, in order to maintain high reliability to the level attained in conventional plastic packages, development was done on thermally resistant insulator and on mold resin which increase the adherence with substrate. Work was also done to reduce the effect of moisture in package through vent hole in pattern substrate. Regarding mounting to the PCB, the CSP developed by us is able to be mounted by merely recognizing of package's high precision outline with laser cutting technology and mounting with other packages is possible due to collective reflow which utilize conventional technologies. Reliability evaluation after mounting has shown that it is very realistic levels for us. By developing the above technologies and developing new materials, packaging technology for a highly reliable CSP was made possible.
Starting Page	1022
Ending Page	1028
File Size	838027
Page Count	7
File Format	PDF
ISBN	078033857X
ISSN	05695503
DOI	10.1109/ECTC.1997.606296
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1997-05-18
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Chip scale packaging Large scale integration Wire Bonding Packaging machines Resins Laser beam cutting Mass production Application specific integrated circuits Transmission line matrix methods
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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