NDLI: TBGA bond process for ground and power plane connections

Content Provider	IEEE Xplore Digital Library
Author	Domadia, A. Mendoza, D.
Copyright Year	1996
Description	Author affiliation: LSI Logic Corp., USA (Domadia, A.)
Abstract	The general construction of the TBGA developed at LSI Logic Corp. is discussed. Ground/power plane connections are typically provided in double metal tape for Tape Ball Grid Array (TBGA) by using plated vias for connections. A unique process which allows ground connections for TBGA package in assembly, rather than in tape is discussed. It further discusses a novel way to provide power plane connections also during assembly of a TBGA package, instead of providing it in the tape. Providing such interconnections in the assembly makes the product more cost effective and TBGA tape becomes more manufacturable. Both equipment and process for this unique "down bond" technique are discussed. Such an interconnection technique is currently being used in manufacturing at LSI Logic Corp.
Starting Page	707
Ending Page	712
File Size	1432843
Page Count	6
File Format	PDF
ISBN	0780332865
ISSN	05695503
DOI	10.1109/ECTC.1996.517462
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1996-05-28
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Bonding Assembly Packaging machines Large scale integration Logic Costs Lead Integrated circuit packaging Application specific integrated circuits Electronics packaging
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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