NDLI: Determination of Young's modulus of thin films used in embedded passive devices

Content Provider	IEEE Xplore Digital Library
Author	Djakaria, R. Chandran, B.I. Gordon, M.H. Schmidt, W.F. Lenihan, T.G.
Copyright Year	1997
Description	Author affiliation: Dept. of Mech. Eng., Arkansas Univ., Fayetteville, AR, USA (Djakaria, R.)
Abstract	An experimental study to determine the Young's modulus of thin films has been performed using both a standard tensile test and a Vickers microindentation test. Currently, the mechanical properties of thin films such as Young's modulus have not been determined by a standard tensile test because of the problem associated with separating the thin films from the silicon wafers without deforming them. To avoid these difficulties, we have implemented a simple technique based on a tensile test of thin film assemblies. In our work, a flexible polyimide film is utilized as the substrate onto which a thin film is deposited. The testing procedure and specimen used were according to ASTM-D882 standards for thin plastic sheeting. Within the ASTM standard conditions and the specified specimen's dimensions, the proposed method is suitable for determining the Young's modulus of aluminum thin films (within 20% uncertainty) providing that the thickness ratio of the tested assembly is greater than 0.72. The results from the tensile test procedure are compared to results obtained using the microindentation technique. The Vickers microindentation method was used to determine the Young's modulus of the polyimide film by analyzing the unloading microindentation curve. The major disadvantage of this technique is that a relatively thick film (>20 /spl mu/m) is required.
Starting Page	745
Ending Page	749
File Size	523359
Page Count	5
File Format	PDF
ISBN	078033857X
ISSN	05695503
DOI	10.1109/ECTC.1997.606253
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1997-05-18
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Transistors Testing Plastic films Semiconductor thin films Assembly Polyimides Performance evaluation Mechanical factors Silicon Substrates
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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