NDLI: Next generation of electronic packaging education at Georgia Tech Packaging Research Center

Content Provider	IEEE Xplore Digital Library
Author	Tummala, R.
Copyright Year	1997
Description	Author affiliation: Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA (Tummala, R.)
Abstract	The Packaging Research Center (PRC), funded by NSF as one of its engineering centers in the US, views research and education being equally important in addressing the competitiveness need in electronic packaging in the next decade. The strategy to achieve this competitiveness goal involves two critical items: (1) development of next generation of technologies; and (2) development of human resources, by means of globally-competitive education to apply the technologies to the global market. The PRC views that four major education challenges must be addressed in order to meet the above need. These are: (1) system-level education. This is currently missing and includes technologies, manufacturing, business economics and management, global markets and foreign culture; (2) cross-discipline education: current university education is highly discipline-oriented, whereas electronic products are highly cross-disciplinary; (3) industry education: industry engineers are immersed in current, short term technologies and generally are not addressing the next generation needs; and (4) undergrad and pre-college education. To address the above challenge, an education strategy has been developed which consists of educational programs grouped into six strategic major categories: (1) undergraduate, (2) graduate; (3) under-represented outreach; (4) industry engineers; (5) national education; and (6) global education. This paper reviews all of these programs.
Starting Page	960
Ending Page	963
File Size	423541
Page Count	4
File Format	PDF
ISBN	078033857X
ISSN	05695503
DOI	10.1109/ECTC.1997.606285
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1997-05-18
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Electronics packaging Educational products Educational programs Educational technology Partial response channels Globalization Electronics industry Industrial economics Manufacturing industries Humans
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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