NDLI: Electrical design of a low cost and high performance plastic ball grid array package-NuBGA

Content Provider	IEEE Xplore Digital Library
Author	Tai-Yu-Chou Wu, F. Lau, J. Kuan-Luen Chen
Copyright Year	1997
Description	Author affiliation: Express Package Syst. Inc., Palo Alto, CA, USA (Tai-Yu-Chou)
Abstract	This paper presents a new class of low cost, electrically and thermally optimized ball grid array packages, called NuBGA (new and useful ball grid array). The package is suitable for both low and high pin count applications. NuBGA is a cavity down package with a metal heatspreader covering the entire back surface of the package. Heat spreader is laminated with a single core double sided organic substrate. Optimized electrical performance is achieved using the design concepts of Split-Wrap-Around (SWA) and Split-Via-Connections (SVC). All traces on the core substrate can be designed into /spl mu/-stripline and co-planar stripline structures. Further enhanced thermal and electrical performance NuBGA can be achieved by applying an additional metal stiffener and thinner core substrate. In this paper, the presentation is focus on (1) the unique design concept, (2) the electrical analysis, (3) the electrical measurement, and (4) the performance comparison with standard packages.
Starting Page	1081
Ending Page	1086
File Size	614343
Page Count	6
File Format	PDF
ISBN	078033857X
ISSN	05695503
DOI	10.1109/ECTC.1997.606304
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1997-05-18
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Costs Electronics packaging Plastic packaging Thermal conductivity Electronic packaging thermal management Copper Static VAr compensators Thermal resistance Nonhomogeneous media Cooling
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Electrical design of a cost-effective thermal enhanced plastic ball grid array package-NuBGA

Thermal evaluation of a cost-effective plastic ball grid array package-NuBGA

Analysis of a thermally enhanced ball grid array package

Flex tape ball grid array

Development of improved thermal performance embedded heat slug plastic ball grid array package

Analysis of a thermally enhanced ball grid array package

Development of 50mm Flipchip Plastic Ball Grid Array Package with Low-K Silicon Technology

Reliability of plastic ball grid array package

Thermal characteristics of single and multilayer high performance PQFP packages

Electrical design of a low cost and high performance plastic ball grid array package-NuBGA

Similar Documents

Electrical design of a cost-effective thermal enhanced plastic ball grid array package-NuBGA

Thermal evaluation of a cost-effective plastic ball grid array package-NuBGA

Analysis of a thermally enhanced ball grid array package

Flex tape ball grid array

Development of improved thermal performance embedded heat slug plastic ball grid array package

Analysis of a thermally enhanced ball grid array package

Development of 50mm Flipchip Plastic Ball Grid Array Package with Low-K Silicon Technology

Reliability of plastic ball grid array package

Thermal characteristics of single and multilayer high performance PQFP packages

Electrical design of a low cost and high performance plastic ball grid array package-NuBGA