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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Ping Zhou Boudreau, R. Bowen, T. |
| Copyright Year | 1997 |
| Description | Author affiliation: AMP Inc., Harrisburg, PA, USA (Ping Zhou) |
| Abstract | A new low cost manufacturing system has been established for the attachment of photonic dies such as lasers and photodetectors. This system is based on wafer scale photonic-die bonding technology-WSPD, recently developed at AMP. WSPD technology combines the passive alignment of optical elements on a silicon or glass wafer board, and fluxless local soldering technology. The approach provides the capability of low cost, high volume (speed), high precision die attachment for hybrid integration of optoelectronic device packaging. |
| Starting Page | 763 |
| Ending Page | 767 |
| File Size | 1033089 |
| Page Count | 5 |
| File Format | |
| ISBN | 078033857X |
| ISSN | 05695503 |
| DOI | 10.1109/ECTC.1997.606256 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 1997-05-18 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Costs Manufacturing systems Photodetectors Photonics Wafer bonding Silicon Glass Soldering Optoelectronic devices Packaging |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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