NDLI: A study of the thermal characteristics of a conductive adhesive chip attach process

Content Provider	IEEE Xplore Digital Library
Author	Sathe, S. Sammakia, B. Kodnani, R. Gaynes, M.
Copyright Year	1997
Description	Author affiliation: Microelectron. Div., IBM Corp., Endicott, NY, USA (Sathe, S.)
Abstract	Electrically conductive adhesives (ECAs) have been proposed as an alternative to solder in the surface mount (SMT) and flip chip attach (FCA) applications. This paper describes the development of a transient heat transfer model of a chip bonding process using the ECA bumps. The chip is heated using a top thermode directly contacting the chip and the card is heated from the back side (Z=0) using a heater. A detailed three-dimensional heat transfer model to account for the conduction, heat storage and convection and radiation from the card is developed using the finite volume technique. The spatial and temporal temperature distributions are studied through initial ramp-up, dwell and cool-down processes. It is seen that the bump temperatures are dominated and controlled by the heating process near the chip as opposed to heating the back side of the card. The numerical model is verified via actual measurements and the agreement is within 15 percent.
Starting Page	1182
Ending Page	1187
File Size	601932
Page Count	6
File Format	PDF
ISBN	078033857X
ISSN	05695503
DOI	10.1109/ECTC.1997.606325
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1997-05-18
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Thermal conductivity Conductive adhesives Heat transfer Heating Surface-mount technology Flip chip Bonding processes Temperature distribution Temperature control Numerical models
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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