NDLI: Non halogen/antimony flame retardant system for high end IC package

Content Provider	IEEE Xplore Digital Library
Author	Yamaguchi, M. Shigyo, H. Yamamoto, Y. Sudo, S. Ito, S.
Copyright Year	1997
Description	Author affiliation: Cover Technol. Center, Nitto Denko Corp., Ibaraki, Japan (Yamaguchi, M.)
Abstract	All industries have started to conduct research in environmentally safe materials. In the electronics industry also environmental issue is one of the most important concerns being addressed with rapid technical improvement. Flame retardant agents like halogen and antimony oxide are used in plastic molding compounds to provide flame retardant characteristics to all plastic encapsulated packages. However these materials have concerns as they are considered environmental hazards. This paper deals with the study of a new environmentally safe flame retardant system for plastic encapsulants. We studied the application of a new non halogen and non antimony oxide flame retardant system for the molding compound of Ball Grid Arrays (BGA) as the next generation conventional standard package.
Starting Page	1248
Ending Page	1253
File Size	565667
Page Count	6
File Format	PDF
ISBN	078033857X
ISSN	05695503
DOI	10.1109/ECTC.1997.606335
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1997-05-18
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Flame retardants Integrated circuit packaging Electronics packaging Packaging machines Plastics Temperature Magnesium compounds Fires Consumer electronics Aluminum
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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