NDLI: Material compatibility and dielectric properties of co-fired high and low dielectric constant ceramic packages

Content Provider	IEEE Xplore Digital Library
Author	Natarajan, R. Dougherty, J.P.
Copyright Year	1997
Description	Author affiliation: Center for Dielectr. Studies, Pennsylvania State Univ., University Park, PA, USA (Natarajan, R.)
Abstract	Recent trend in integrated ceramics is to have a 3-dimensional integration of passive components onto the low permittivity dielectric substrate to achieve a monolithic multilayer ceramic (MMC) substrate. MMC substrates offer significant gain in both circuit density and device hermiticity leading to increased reliability and low cost packages. Low-temperature glass-ceramic based low K tapes have been demonstrated to have good compatibility with silver metallization and resistor inks. To push the level of passive component integration one step forward, we studied the materials compatibility and co-firing aspects of low K tapes with high dielectric constant Pb-based relaxer materials. Li salt addition to high K ceramic tape was found to be effective in reducing the sintering temperature to match with that of low K tape. It also improved the dielectric properties and, most importantly, gave a wider processing window for the high K material. This paper describes the optimization of the high K tape casting process such as slurry preparation, rheology, solid content, tape release, lamination, and shrinkage matching with the low-K substrate. This paper also demonstrates the successful integration of high and low K materials.
Starting Page	750
Ending Page	754
File Size	1673492
Page Count	5
File Format	PDF
ISBN	078033857X
ISSN	05695503
DOI	10.1109/ECTC.1997.606254
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1997-05-18
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Dielectric materials Dielectric substrates High K dielectric materials High-K gate dielectrics Ceramics Permittivity Nonhomogeneous media Integrated circuit reliability Costs Packaging
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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