NDLI: Transient thermal analysis of electronic packages by the boundary element method

Content Provider	IEEE Xplore Digital Library
Author	Guven, I. Chan, C.L. Madenci, E.
Copyright Year	1997
Description	Author affiliation: Dept. of Aerosp. & Mech. Eng., Arizona Univ., Tucson, AZ, USA (Guven, I.)
Abstract	The fabrication of electronic packages involves heating and then cooling from high processing temperatures. Because these devices consist of bonded materials with different thermal and mechanical properties, high thermo-mechanical stresses develop due to thermal and stiffness mismatches of bonded materials at regions with geometric and/or material discontinuities. These high stresses may result in crack initiations, leading to delaminations. Therefore, accurate temperature and flux distributions are critical when computing thermo-mechanical stresses, knowledge of which is essential for reliable designs. This study presents an analysis method based on the Boundary Element Method (BEM) to investigate the transient thermal response of electronic packages consisting of dissimilar materials while subjected to general boundary conditions. In order to demonstrate its capability, a chip on a substrate configuration subject to natural cooling is considered. The boundary conditions across the interfaces between the chip and the adhesive and adhesive and substrate are matched through exact expressions. The results capture the singular flux field arising from the mismatch in the thermal conduction coefficients and geometric discontinuity. The comparison of the results with those obtained from finite element analysis shows that BEM is rather robust and efficient for this class of transient conduction analyses.
Starting Page	279
Ending Page	288
File Size	753512
Page Count	10
File Format	PDF
ISBN	078033857X
ISSN	05695503
DOI	10.1109/ECTC.1997.606182
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1997-05-18
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Transient analysis Electronic packaging thermal management Thermal stresses Electronics cooling Bonding Thermomechanical processes Boundary conditions Fabrication Heating Temperature
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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