NDLI: Conductive adhesive flip-chip bonding for bumped and unbumped die

Content Provider	IEEE Xplore Digital Library
Author	Connell, G. Zenner, R.L.D. Gerber, J.A.
Copyright Year	1997
Description	Author affiliation: 3M Co., St. Paul, MN, USA (Connell, G.)
Abstract	Conductive adhesive interconnection for flip-chip-on-flex is discussed for both bumped and unbumped die. The flip-chip connections are made by applying heat and pressure to a conductive adhesive film. During the bonding process adhesive is pushed out of the way allowing the conductive particles to connect to the conductive pads and traces. If the proper conditions are applied, a reliable connection is made. The most stable connections were made with a gold-bumped die. However, reliable connections to unbumped die were also demonstrated using gold-coated nickel particles. The samples were prepared by patterning the particles in a grid array and then directing the flow of the adhesive towards the center of the chip rather than outward. This directed flow is accomplished by allowing the, chip to deflect under the influence of the adhesive pressure. Results for both kind of die show that once a good initial contact is made, the resistance is stable in accelerated aging environments.
Starting Page	274
Ending Page	278
File Size	1119817
Page Count	5
File Format	PDF
ISBN	078033857X
ISSN	05695503
DOI	10.1109/ECTC.1997.606181
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1997-05-18
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Conductive adhesives Costs Thermal stresses Contact resistance Bonding processes Substrates Polyethylene Positron emission tomography Thermal expansion Insulation
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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