NDLI: The oxidation control of copper leadframe package for prevention of popcorn cracking

Content Provider	IEEE Xplore Digital Library
Author	Takano, E. Mino, T. Takahashi, K. Sawada, K. Shimizu, S. Yoo, H.Y.
Copyright Year	1997
Description	Author affiliation: Semicond. Adv. Packaging Eng. Dept., Toshiba Corp., Japan (Takano, E.)
Abstract	Copper alloy leadframe has good thermal, electrical, mechanical and cost performance. It, however, is susceptible to package cracking during reflow soldering due to poor adhesion of the molding compound to the leadframe. In this paper we investigated the oxide film properties of copper leadframe and the effect of the film on the reliability performance of semiconductor packages. According to our experiment, oxide film growth was expressed as a function of time and temperature and the growth of the oxide film was surpressed when oxygen concentration was less than 5%. An adhesion strength test of epoxy molding compound to the oxidized copper surface showed drastic degradation of strength if the film thickness exceeded about 20 nm accompanied with delaminating surface alternation. Finally, we conducted a reflow cracking test with samples whose oxide film thickness was controlled. The results showed good correlation with the adhesion strength test. It was found that the oxide film thickness should be less than 40 nm to enhance reflow crack performance.
Starting Page	78
Ending Page	83
File Size	510621
Page Count	6
File Format	PDF
ISBN	078033857X
ISSN	05695503
DOI	10.1109/ECTC.1997.606149
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1997-05-18
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Oxidation Semiconductor films Adhesives Testing Semiconductor device packaging Lead compounds Surface cracks Copper alloys Costs Reflow soldering
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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Oxide adhesion characteristic of lead frame copper alloys

Oxide adhesion characteristic of lead frame copper alloys

Effect of oxidation on mold compound-copper leadframe adhesion

Adhesion integrity evaluation of plastic encapsulated semiconductor package

Oxidation failure of Lead Frame Copper alloys with Surface Electroplated Pure Cu

Increasing IC Leadframe Package Reliability

A novel die bonding adhesive-silver filled film

Investigation on the effect of molding compounds on package delamination

Simplified and practical estimation of package cracking during reflow soldering process

The oxidation control of copper leadframe package for prevention of popcorn cracking

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