NDLI: Cracking analysis of plastic IC package in consideration of viscoelasticity

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Cracking analysis of plastic IC package in consideration of viscoelasticity

Content Provider	IEEE Xplore Digital Library
Author	Ji Hyuck Yang Kang Yong Lee
Copyright Year	2000
Description	Author affiliation: Dept. of Mech. Eng., Yonsei Univ., Seoul, South Korea (Ji Hyuck Yang)
Abstract	The purpose of this paper is to consider failure phenomena by delamination and cracking when an encapsulant for plastic IC packaging under hygrothermal loading in the IR soldering process is on viscoelastic behavior and to present the optimum design using fracture mechanics. The model for analysis is the plastic SOJ (small outline J-lead) package with a dimpled diepad. A package model with perfect delamination between chip and diepad is chosen to estimate the fracture resistance by calculating C(t)-integrals with the change of the design under hygrothermal loading. The optimum design to depress delamination and crack growth in the plastic IC package is presented.
Starting Page	251
Ending Page	257
File Size	585519
Page Count	7
File Format	PDF
ISBN	0780366441
DOI	10.1109/EPTC.2000.906382
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2000-12-07
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Plastic integrated circuit packaging Viscosity Elasticity Moisture Thermal stresses Delamination Plastic packaging Electromagnetic compatibility Lead Electronic packaging thermal management
Content Type	Text
Resource Type	Article

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