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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Kleiner, M.B. Kuhn, S.A. Weber, W. |
| Copyright Year | 1995 |
| Description | Author affiliation: Corp. Res. & Dev., Siemens AG, Munich, Germany (Kleiner, M.B.; Kuhn, S.A.; Weber, W.) |
| Abstract | In this paper, potential performance improvements of the memory hierarchy of RISC-systems for implementations employing 3-D-technology are investigated. Relating to RISC-systems, 3-D ICs will offer the opportunity for integrating much more memory on-chip (i.e. on one IC or 3-D IC with the processor). As a result, the second-level cache may be moved on-chip. The available on-chip cache may alternatively be organized in three levels. Investigations were also performed for the case of the main memory being integrated on-chip. Current restrictions of conventional RISC-system implementations, such as limited available transistor count for on-chip caching, confined data bus width between processor-chip and the off-chip second-level cache, long access times of the second-level cache, strongly limit the achievable performance of the memory hierarchy and may be either removed or at least substantially reduced by the use of 3-D ICs. To evaluate the performance improvements of implementations employing 3-D ICs, a model based on measured miss rates and on an analytical access time model is used. The average time per-instruction is employed as the performance measure. Results of extensive case studies indicate, that substantial performance improvements depending on implementation, cache sizes, cache organization, and miss rates are achievable using 3-D ICs. A comparison of four optimized implementations all with a total cache size of approximately 1 MB yielded performance improvements in the range of 23% to 31% for the implementations employing 3-D-technology over the conventionally implemented system. It is concluded that 3-D-technology will be very attractive for future high performance RISC-systems, since the system performance depends vitally on the performance of the memory hierarchy. |
| Starting Page | 645 |
| Ending Page | 655 |
| File Size | 1197127 |
| Page Count | 11 |
| File Format | |
| ISBN | 0780327365 |
| DOI | 10.1109/ECTC.1995.515351 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 1995-05-21 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Three-dimensional integrated circuits System performance Time measurement Research and development Application specific integrated circuits Performance analysis Analytical models Integrated circuit technology Application software High performance computing |
| Content Type | Text |
| Resource Type | Article |
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