NDLI: Silicon motherboards for multichannel optical modules

Content Provider	IEEE Xplore Digital Library
Author	Ambrosy, A. Richter, H. Hehmann Ferling, D.
Copyright Year	1995
Description	Author affiliation: Alcatel CRC, Stuttgart, Germany (Ambrosy, A.; Richter, H.; Hehmann; Ferling, D.)
Abstract	A novel method of a fluxless, high precision and reliable Au/Au thermo compression flip chip bonding process for optoelectronic devices has been developed. The main technologies for the manufacturing of multichannel optical modules are based on the height control within 0.5 /spl mu/m of electro plated Au bumps on silicon motherboards in the close environment of v-grooves, the flip chip bonding applying low pressure at temperatures below 300/spl deg/C and reproducible passive fiber array alignment with high coupling efficiencies. A coupling loss of 8.5 dB has been achieved, which is very close to the active alignment result of 8.1 dB. The reliability of flip chip bonded laser and photo diodes has been investigated by ageing and temperature cycling tests, where no shift of the threshold current occurred, the coupling efficiency did not vary and the dark current showed no degradation. The RF performance of the electrical interconnection on the silicon motherboard has been analysed and a transmission experiment at 622 Mbit/s has been done successfully.
Starting Page	570
Ending Page	576
File Size	1187286
Page Count	7
File Format	PDF
ISBN	0780327365
DOI	10.1109/ECTC.1995.515340
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1995-05-21
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Silicon Gold Flip chip Optical arrays Optical coupling Bonding processes Optoelectronic devices Manufacturing Pressure control Optical control
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Silicon motherboards for multichannel optical modules

A room temperature flip-chip mounting technique for laser diodes on silicon motherboards

Flexible manufacturing of multichip modules for flip chip ICs

Flip chip bonders for high end optoelectronic modules

Flip chip bonded optoelectronic devices on ultra-thin silicon-on-sapphire

Application of flip-chip-bonders in AuSn solder processes to achieve high after bonding accuracy for optoelectronic modules

Fluxless Sn-rich Sn-Au flip-chip bonding using electroplating processes

Submicron flip chip bonding technology for opto-electronic devices

Flip chip equipment for high end electro-optical modules

Silicon motherboards for multichannel optical modules

Similar Documents

Silicon motherboards for multichannel optical modules

A room temperature flip-chip mounting technique for laser diodes on silicon motherboards

Flexible manufacturing of multichip modules for flip chip ICs

Flip chip bonders for high end optoelectronic modules

Flip chip bonded optoelectronic devices on ultra-thin silicon-on-sapphire

Application of flip-chip-bonders in AuSn solder processes to achieve high after bonding accuracy for optoelectronic modules

Fluxless Sn-rich Sn-Au flip-chip bonding using electroplating processes

Submicron flip chip bonding technology for opto-electronic devices

Flip chip equipment for high end electro-optical modules

Silicon motherboards for multichannel optical modules