NDLI: Polyimide stress cushion for multichip glass-ceramic module packaging

Content Provider	IEEE Xplore Digital Library
Author	Shih, D.-Y. Palmateer, P. Fu, Y. Kapur, S. Ghosal, B. Brofman, P. Lauro, P. Norcott, M.
Copyright Year	1995
Description	Author affiliation: IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA (Shih, D.-Y.; Palmateer, P.; Fu, Y.)
Abstract	The performance of the IBM glass ceramic-copper multilayer ceramic module (MLC) is significantly enhanced by a revolutionary set of packaging materials. Low dielectric constant cordierite glass ceramic (/spl epsiv/-5.0), co-sintered with high conductivity copper (/spl rho/-3.5 /spl mu//spl Omega/-cm), was developed and integrated into the high performance glass ceramic thermal conduction modules (TCM) used in the IBM System/390-Enterprise system/9000 series of mainframe computers. Low stress pin attach structures have been developed for the glass ceramic module. They include the multilayer thin film I/O pad, taper headed pin and polyimide-cushioned pin structure. All of the approaches were shown to reduce the pin joint stress significantly and, as a consequence, led to the construction of a robust pin joint that is fully compatible with the glass ceramic substrate.
Starting Page	728
Ending Page	738
File Size	3408012
Page Count	11
File Format	PDF
ISBN	0780327365
DOI	10.1109/ECTC.1995.517768
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1995-05-21
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Polyimides Stress Glass Ceramics Nonhomogeneous media Thermal conductivity Packaging Conducting materials Dielectric materials Dielectric constant
Content Type	Text
Resource Type	Article

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