NDLI: Diffusion model to derate moisture sensitive surface mount ICs for factory use conditions

Content Provider	IEEE Xplore Digital Library
Author	Shook, R.L. Conrad, T.R. Sastry, V.S. Steele, D.B.
Copyright Year	1995
Description	Author affiliation: AT&T Bell Labs., Breinigsville, PA, USA (Shook, R.L.; Conrad, T.R.)
Abstract	Recent industry specifications JESD22-A112 and IPC-SM-786A have identified a set of moisture sensitivity levels for classification of moisture/reflow sensitive devices. The established test conditions are meant to represent average worst case factory environmental conditions that a plastic packaged surface mount IC can safely be exposed to after opening of the protective dry-bag. The exposure times imposed by the level classifications relate specifically to the equivalent testing condition, e.g., a Level 3 device must be assembled within 168 hours for a factory environment of 30/spl deg/C/60%RH. No equivalent exposure times are addressed by the specifications if the factory ambients are not at 30/spl deg/C and 60%RH. This paper addresses the issue of equivalent exposure times for varying temperature-humidity conditions that a factory could maintain. A "derating" procedure has been developed that adopts a first principles approach for solution to moisture diffusion into plastic packages. 1-D and 3-D mathematical and computer generated solutions for moisture diffusion were obtained for plastic packaged ICs. Critical moisture concentrations achieved during JEDEC/IPC testing conditions at internal interfaces were calculated and used as a criterion for the "derating" procedure. Based on this approach, an equivalency table can be developed for any combination of factory temperature and humidity conditions.
Starting Page	440
Ending Page	449
File Size	933719
Page Count	10
File Format	PDF
ISBN	0780327365
DOI	10.1109/ECTC.1995.515319
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1995-05-21
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Moisture Production facilities Plastic packaging Semiconductor device modeling Integrated circuit testing Plastic integrated circuit packaging Protection Assembly Temperature Humidity
Content Type	Text
Resource Type	Article

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