NDLI: Reactions of high lead solders with BIOACT EC-7R semi-aqueous cleaning reagent

Content Provider	IEEE Xplore Digital Library
Author	Wong, C.P. Gillum, W.O. Walters, R.A. Sakach, P.J. Powell, D. Boomer, B.
Copyright Year	1995
Description	Author affiliation: AT&T Bell Labs., Princeton, NJ, USA (Wong, C.P.; Gillum, W.O.; Walters, R.A.; Sakach, P.J.)
Abstract	Due to environmental concerns, terpene based cleaning fluids have replaced Freon in cleaning baths at several AT&T manufacturing sites. The terpene formulations employed in semi-aqueous processes, typically, are used to deflux circuit boards where most of the interconnections are formed using 60 Sn/40 Pb solder. Recently, the use of terpene cleaning, BIOACT EC-7R, was extended to thin film ceramic substrates where high lead solder (95 Pb/5 Sn) forms the interconnection. In the presence of high lead solder, EC-7R quickly changes from colorless to bright yellow. In addition, the cleaning process deteriorates and residues are found on the circuits. Thus, the use of high lead solder leads to the replacement of the cleaning baths at shorter time intervals (four weeks) than when 60 Sn/40 Pb solder is present (6 months). The goal of the work discussed below is to elucidate the reactions between the circuit metallurgy and the EC-7R chemical composition.
Starting Page	1016
Ending Page	1027
File Size	1378301
Page Count	12
File Format	PDF
ISBN	0780327365
DOI	10.1109/ECTC.1995.517817
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1995-05-21
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Lead Cleaning Tin Integrated circuit interconnections Manufacturing Printed circuits Thin film circuits Ceramics Substrates Chemicals
Content Type	Text
Resource Type	Article

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