NDLI: Reliability and analytical evaluations of no-clean flip-chip assembly

Content Provider	IEEE Xplore Digital Library
Author	Clementi, J.J. Dearing, G.O. Zimmerman, J.A. Bergeron, C.
Copyright Year	1995
Description	Author affiliation: IBM Microelectron. Div., Endicott, NY, USA (Clementi, J.J.; Dearing, G.O.; Zimmerman, J.A.)
Abstract	A process has been developed, qualified and implemented to replace traditional flip-chip (C4-Controlled Collapse Chip Connection) joining on ceramic carriers with a new no-clean technique. This important technical achievement overcomes existing cleaning limitations on attaching flip-chip C4's at high melt soldering conditions. Previous no-clean assembly was limited to Direct Chip Attach (DCA) on organic substrates at low reflow eutectic (<300/spl deg/C) soldering temperatures. Significant cost and environmental benefits have been realized with this process simplification. The new method uses a mild fluxing material and reducing atmosphere for flip-chip assembly. It is a tremendous advancement for mounting flip-chip C4's with high lead content to corresponding copper pads at high reflow (>300/spl deg/C) temperatures. The no-clean process enabled removal of cleaning steps which increased manufacturing efficiency and greatly reduced product cost. Also, elimination of chlorinated cleaning solvents has accomplished government mandated reductions on their usage. Assembly, analytical and reliability characterization has been performed to support this important development in flip-chip joining. These studies have provided a comprehensive understanding of process parameters, controls, reaction and yields while assessing component reliability. This thorough evaluation of no-clean assembly processing was critical to successful implementation of the breakthrough accomplishment.
Starting Page	1191
Ending Page	1196
File Size	1611787
Page Count	6
File Format	PDF
ISBN	0780327365
DOI	10.1109/ECTC.1995.517841
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1995-05-21
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Assembly Cleaning Soldering Temperature Ceramics Joining processes Atmosphere Lead Copper Manufacturing processes
Content Type	Text
Resource Type	Article

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