NDLI: Area bonding conductive (ABC) adhesives for flex circuit connection to LTCC/MCM substrates

Content Provider	IEEE Xplore Digital Library
Author	Bolger, J.C. Reynolds, M. Popielarczyk, J.
Copyright Year	1995
Description	Author affiliation: Merix Corp., Needham, MA, USA (Bolger, J.C.; Reynolds, M.)
Abstract	This paper describes the use, at the Harris Corporation, of a new type of Z-axis conductive epoxy adhesive for connecting four high density Multichip Modules (MCM's) together using fine pitch flex circuits. The MCM's fold together into the size of a cigarette pack. The flex circuits are copper/polyimide and the MCM substrates are made from Low Temperature Co-fired Ceramic (LTCC). The conductive pads on the flex circuit and on the substrate are in the shape of a series of parallel lines on a pitch down to 0.4 mm. The new adhesives, called area bonding conductive (ABC) epoxy adhesives, were developed under an ARPA contract at the Merix Corp., and are made by a new screening and stencilling process, to produce high strength thermosetting (dielectric) epoxies, which also contain a customized line pattern of electrically conductive epoxy adhesive. In contrast to previous random particle Z-axis adhesives, the ABC adhesives are conductive only at the desired bond pad locations and require no pressure to establish or maintain electrical contacts. This paper shows the bonding and assembly process, explains the cost and other advantages over the previous hot-bar reflow soldering method, and presents thermal shock and other reliability test results.
Starting Page	529
Ending Page	533
File Size	1482868
Page Count	5
File Format	PDF
ISBN	0780327365
DOI	10.1109/ECTC.1995.515333
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1995-05-21
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Bonding Flexible electronics Joining processes Multichip modules Copper Polyimides Temperature Ceramics Shape Contracts
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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