NDLI: A novel elastomeric connector for packaging interconnections, testing and burn-in applications

Content Provider	IEEE Xplore Digital Library
Author	Shih, D.-Y. Beaman, B. Lauro, P. Fogel, K. Norcott, M. Walker, G.F. Hedrick, J. Shi, L. Doany, F. Shaw, J.
Copyright Year	1995
Description	Author affiliation: IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA (Shih, D.-Y.)
Abstract	Elasticon connectors have been developed for a wide variety of interconnection and test applications which include module-to-board, board-to-board interconnections; high density module, board and LCD testings; as well as chip/wafer testing and burn-in to produce Known-Good-Die. Depending on the applications, the Elasticon connectors can be fabricated into two basic types, the single-sided (integrated to a substrate) and the double-sided (interposer) structure. The single-sided structure, the Integrated Probe, is designed and fabricated for test and burn-in applications. The density, compliance, thickness, pattern and size of both the one- and two-sided structures can be easily tailored to meet the requirements of each specific application. The fabrication processes involve wire bonding, laser and polymer casting and curing. The electrical, mechanical and thermal properties of the connector have been fully characterized. To achieve high compliance with low contact force, a proprietary elastomeric material has been formulated to achieve not only high compliance but high thermal stability. The conductive element uses highly conductive, corrosion free, and oxidation resistant noble metals and their alloys. The reliability and durability of the elastomeric connector have been evaluated with mechanical cycling, thermal cycling, stress relaxation, outgassing, and temperature and humidity rest. The thermal stability of the connector, including both the polymer and the conductive element, has been measured to exceed the burn-in temperatures, which range from 125 to 180/spl deg/C.
Starting Page	126
Ending Page	133
File Size	1105790
Page Count	8
File Format	PDF
ISBN	0780327365
DOI	10.1109/ECTC.1995.514372
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1995-05-21
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Connectors Packaging Testing Polymers Thermal force Thermal stability Thermal stresses Probes Optical device fabrication Wire
Content Type	Text
Resource Type	Article

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