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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Yoshizawa, S. Hirano, S. Yamamoto, R. Hishinuma, Y. Nishimura, A. Matsumoto, A. Kumakura, H. |
| Copyright Year | 2002 |
| Abstract | To improve superconductivity and mechanical properties of Bi-2223 sintered bulk, silver (Ag) wires of 0.4 mm in diameter were added to the bulk. The sample was sintered at 840/spl deg/C for 50 hours in air. After treatment with cold isostatic pressing (CIP), the sample was re-sintered. When twenty-four Ag wires were composed, the critical current density (J/sub c/) at 4.2 K and self-field increased from 1,200 A/cm/sup 2/ to 2,000 A/cm/sup 2/ with the CIP process. SEM observation results showed that high alignment and dense structures of Bi-2223 plate-like grains were formed around the interfacial region between the superconducting oxide and the metal Ag. The mechanical properties were measured by a three point bending test. The maximum bending stress of 60 MPa was obtained in the bulk without Ag wire, which was fractured separately. With the CIP process the maximum bending stress increased to 90 MPa for the composite. The composite did not fracture but only fine cracks were induced after the maximum bending stress. |
| Sponsorship | Council on Superconductivity Appl. Superconductivity Conference Inc MIT |
| Starting Page | 3176 |
| Ending Page | 3179 |
| Page Count | 4 |
| File Size | 976277 |
| File Format | |
| ISSN | 10518223 |
| Volume Number | 13 |
| Issue Number | 2 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2003-06-01 |
| Publisher Place | U.S.A. |
| Access Restriction | One Nation One Subscription (ONOS) |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Superconductivity Mechanical factors Pressing Stress Silver Critical current density Superconducting filaments and wires Superconducting magnets Testing Magnetic materials |
| Content Type | Text |
| Resource Type | Article |
| Subject | Condensed Matter Physics Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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