NDLI: Protection of DRAM Spatial Light Modulators from Incident Light using a Multilevel Metallization Procedure

Content Provider	IEEE Xplore Digital Library
Author	O'Hara, A. Begbie, M. Rankin, I. Burns, D.C. Gourlay, J. Underwood, I. Vass, D.G.
Copyright Year	1995
Description	Author affiliation: Department of Electrical Engineering, The University of Edinburgh, Edinburgh, EH9 3JL. UK (Rankin, I.; Burns, D.C.; Underwood, I.) \|\| Department of Physics, The University of Edinburgh, Edinburgh, EH9 3JL. UK (O'Hara, A.; Begbie, M.; Gourlay, J.; Vass, D.G.)
Abstract	Liquid Crystal (LC) over silicon spatial light modulators (SLMs) have the potential to be used in miniature head mounted displays and in compact projection display systems. For this application the silicon backplane design is invariably based on a single transistor DRAM memory layout which offers the potential for very high resolution devices. However, a problem arises when these devices are incorporated into optical systems. Light incident onto the circuitry causes charge leakage to the substrate, this in tum reduces the voltage on the modulating electrode, which results in the LC switching from its intended state. This problem is compounded by the desire to use these devices with large light intensities which increases the rate of charge leakage. The light incident onto the circuitry can be reduced by employing a double metal process and using the second level to fabricate a large pixel electrode which then shields the underlying circuitry. However, the second metal layer is deposited onto a very uneven surface due to the topography of the circuitry. As the electrode is also used as the mirror to reflect the incident light the device has poor optical performance. To overcome this problem we have employed a post-processing procedure to provide the second level of metallization which was applied to commercially fabricated wafers. To ensure a high optical quality substrate onto which this second metal level is deposited the interlevel dielectric is planarised using chemical mechanical polishing.
Starting Page	277
Ending Page	280
File Size	1294759
Page Count	4
File Format	PDF
ISBN	286332182X
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1995-09-25
Publisher Place	The Netherlands
Access Restriction	Subscribed
Rights Holder	Editions Frontieres
Subject Keyword	Protection Random access memory Optical modulation Metallization Liquid crystal displays Circuits Optical devices Electrodes Silicon Dielectric substrates
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Packaging of high resolution Si based spatial light modulators for display applications

2D silicon/ferroelectric liquid crystal spatial light modulators

Hydrogenated amorphous silicon PIN photodiode for optically addressed spatial light modulators

Spatial light modulators for phase-only modulation

A Projection System for Real World Three-Dimensional Objects Using Spatial Light Modulators

Advances in optoelectronic spatial light modulators

Liquid crystal-on-silicon smart pixel spatial light modulators

The liquid crystal light valve—A new display device

Modulators And Detectors For VLSI/FLC Smart Spatial Light Modulators

Protection of DRAM Spatial Light Modulators from Incident Light using a Multilevel Metallization Procedure

Similar Documents

Packaging of high resolution Si based spatial light modulators for display applications

2D silicon/ferroelectric liquid crystal spatial light modulators

Hydrogenated amorphous silicon PIN photodiode for optically addressed spatial light modulators

Spatial light modulators for phase-only modulation

A Projection System for Real World Three-Dimensional Objects Using Spatial Light Modulators

Advances in optoelectronic spatial light modulators

Liquid crystal-on-silicon smart pixel spatial light modulators

The liquid crystal light valve&#8212;A new display device

Modulators And Detectors For VLSI/FLC Smart Spatial Light Modulators

Protection of DRAM Spatial Light Modulators from Incident Light using a Multilevel Metallization Procedure

The liquid crystal light valve—A new display device