NDLI: 3D transient thermal solver using non-conformal domain decomposition approach

Content Provider	IEEE Xplore Digital Library
Author	Jianyong Xie Swaminathan, M.
Copyright Year	2012
Description	Author affiliation: Interconnect and Packaging Center (IPC), School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA 30332 (Jianyong Xie; Swaminathan, M.)
Abstract	3D integration becomes promising to be able to continue the system integration trend due to short TSV interconnection used for stacked dies. This paper proposes an efficient transient thermal modeling method using non-conformal domain decomposition approach for 3D stacked ICs and systems. To alleviate the problem arising from the feature scale difference between stacked dies as well as package and PCB, the 3D system is divided into many subdomains. Each subdomain (die, package or PCB) can be meshed independently using different gridding based on its feature size and therefore the required meshing cells are greatly reduced compared to conventional method such as finite element or finite volume method. The heat flow continuity between subdomains is captured using the introduced interface basis functions. In addition, the proposed compact micro-fluidic model based on finite volume method is proved to be compatible with the finite element model for solid medium based on introduced forced convection boundary and energy conservation. The experimental results show the proposed method offers up to 5x unknown reduction and 91x speed-up compared to conventional finite element method.
Starting Page	333
Ending Page	340
File Size	1002422
Page Count	8
File Format	PDF
ISBN	9781450315739
ISSN	10923152
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2012-11-05
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Association for Computing Machinery, Inc. (ACM)
Subject Keyword	Solid modeling Integrated circuit modeling Mathematical model Finite element methods Equations Cooling Computational modeling multiscale Domain decomposition transient fluidic cooling
Content Type	Text
Resource Type	Article
Subject	Computer Graphics and Computer-Aided Design Computer Science Applications Software

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