NDLI: Co-simulations of electromagnetic and thermal effects in electronic circuits using non-conformal numerical methods

Content Provider	IEEE Xplore Digital Library
Author	Jin-Fa Lee Yang Shao Zhen Peng
Copyright Year	2012
Description	Author affiliation: The Ohio State University, ElectroScience Lab., ECE Dept., 1320 Kinnear Rd., Columbus, OH 43212 (Jin-Fa Lee; Yang Shao; Zhen Peng)
Abstract	Advances in interconnect technologies, such as the increase of the number of metal layers and 3-D stacking technique, have paved the way for higher functionality and superior performance while reducing size, power, and cost in today's integrated circuits and package products. With the increase of clock frequency and edge rates as well as the continuously downscaling of feature size and 3-D interconnect technologies in high-speed systems, signal integrity (SI) effects such as signal delay, reflection, attenuation, dispersion and crosstalk have become one of the dominant factors in current deep sub-micrometer CMOS technologies limiting overall performance of high-speed systems.
Starting Page	499
Ending Page	499
File Size	306613
Page Count	1
File Format	PDF
ISBN	9781450315739
ISSN	10923152
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2012-11-05
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Association for Computing Machinery, Inc. (ACM)
Subject Keyword	Silicon Integrated circuit interconnections Metals Educational institutions Conductivity Couplings
Content Type	Text
Resource Type	Article
Subject	Computer Graphics and Computer-Aided Design Computer Science Applications Software

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