NDLI: Electromigration-aware routing for 3D ICs with stress-aware EM modeling

Content Provider	IEEE Xplore Digital Library
Author	Jiwoo Pak Sung Kyu Lim Pan, D.Z.
Copyright Year	2012
Description	Author affiliation: Dept. of Electrical and Computer Engineering, The Univ. of Texas at Austin (Jiwoo Pak; Pan, D.Z.) \|\| School of Electrical and Computer Engineering, Georgia Inst. of Tech. (Sung Kyu Lim)
Abstract	Electromigration (EM) has become a key reliability concern for nanometer IC designs. For 3D ICs, higher current density/temperature and TSV-induced thermal mechanical stress further exacerbate the EM issue compared to 2D ICs. In this paper, we analyze the root causes of EM for 3D IC signal nets, with consideration of current density, temperature, and TSV-induced thermal mechanical stress. We develop compact EM models for both DC and AC signal nets using detailed finite-element-analysis (FEA) and build EM library for mean-time-to-failure (MTTF). For AC signal nets, we convert AC current into equivalent DC current and model EM with it. One unique property of EM in 3D ICs is that, depending on the current direction, TSV-induced stress may degrade or improve the MTTF, thus routing plays an important role for EM mitigation. We suggest EM-aware routing algorithms for 3D ICs for the first time to our best knowledge, guided by our stress-aware EM modeling. Experimental result shows that our proposed approach improves EM-robustness of 3D IC benchmarks significantly, e.g., 66.4% less EM-violated grids with little sacrifice of conventional routing objectives.
Starting Page	325
Ending Page	332
File Size	2363464
Page Count	8
File Format	PDF
ISBN	9781450315739
ISSN	10923152
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2012-11-05
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Association for Computing Machinery, Inc. (ACM)
Subject Keyword	Stress Routing Wires Through-silicon vias Current density Libraries Metals
Content Type	Text
Resource Type	Article
Subject	Computer Graphics and Computer-Aided Design Computer Science Applications Software

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