NDLI: Effects of package and mold cavity structures on the wire sweep behavior during package array transfer molding

Content Provider	IEEE Xplore Digital Library
Author	Jiale Han Haibin Chen Fei Wong Leung, K. Shiu, I. Jingshen Wu
Copyright Year	2011
Description	Author affiliation: Center for Engineering Materials and Reliability (CEMAR), Department of Mechanical Engineering, HKUST, Hong Kong (Jiale Han; Haibin Chen; Jingshen Wu) \|\| NXP Semiconductors Hong Kong Limited, Hong Kong (Fei Wong; Leung, K.; Shiu, I.)
Abstract	In order to maximize product throughput, an increasing number of electronic packages, such as Small Outline Transistor (SOT) package, are manufactured in a package array mold. Due to the complicated structure design of the package and mold cavity, wire sweep is becoming an increasingly severe problem. In this study, the numerical model which had been validated by experimental work was used for wire sweep analysis. Firstly, the leadframe structure was studied. Given the thin thickness of leadframe and the relative position to the bond wire loop, the leadframe structure has very limited influence on the wire sweep value. Besides, for fixed width and length of the die, the wire sweep behavior was simulated to examine the influence of the die height (thickness). The results show that the thinner the die, the smaller the wire sweep. Furthermore, the effect of cavity height on wire sweep value was also estimated. Based on the previous simulation and analyses, the ratio of the die height to that of the cavity was introduced as an index to optimize the flow pattern of epoxy molding compound (EMC) in order to find a guideline for package and cavity design to avoid the wire sweep issue. In addition, the influence of injection velocity and viscosity of EMC on wire sweep during transfer molding process were inspected and discussed according to the simulation results as well. It can be further concluded that the velocity plays the key role in resulting in the severe wire sweep in package array mold during transfer molding process.
Starting Page	667
Ending Page	673
File Size	2152050
Page Count	7
File Format	PDF
ISBN	9781457719837
e-ISBN	9781457719820
e-ISBN	9781457719813
DOI	10.1109/EPTC.2011.6184502
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2011-12-07
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Wires Cavity resonators Lead Logic gates Transfer molding Electromagnetic compatibility Arrays
Content Type	Text
Resource Type	Article

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