NDLI: High thermal performance ICP die attach process design and development for LQFP-EP

Content Provider	IEEE Xplore Digital Library
Author	Lim Fui Yee Khoo Ly Hoon Tiu Kong Bee Yow Kai Yun
Copyright Year	2011
Description	Author affiliation: Freescale Semiconductor Malaysia Sdn. Bhd., 2, Jln. SS8/2, Free Industrial Zone Sungei Way, 47300 P.J. Selangor, Malaysia (Lim Fui Yee; Khoo Ly Hoon; Tiu Kong Bee; Yow Kai Yun)
Abstract	Many semiconductor devices require very high thermal performance, especially the automotive industry. Die attach material selection is a critical segment for achieving high thermal performance and stringent reliability requirements. The stringent reliability requirement at high temperature and long operating hour test is needed to test the robustness of the device and its package. Typically, solder interconnect is a more suitable candidate to meet the high temperature and long test cycle. While it is known that a metal to metal connection is sustainable at high temperatures, for certain packages, design limitations and cost advantages are the driving forces for development of epoxy type die attach materials.
Starting Page	190
Ending Page	194
File Size	815561
Page Count	5
File Format	PDF
ISBN	9781457719837
e-ISBN	9781457719820
e-ISBN	9781457719813
DOI	10.1109/EPTC.2011.6184413
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2011-12-07
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Microassembly Resins Iterative closest point algorithm Curing Reliability Delamination
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in