NDLI: MEMS technology on wafer-lever LED packaging

Content Provider	IEEE Xplore Digital Library
Author	Chunming Chang Chenghan Huang Tenghsien Lai Chingfu Tsou Thong-Shing Hwang Chiming Chen
Copyright Year	2011
Description	Author affiliation: The Graduate Institute of Electrical and Communications Eng., Ph.D. Program, Feng Chia University, Taichung, Taiwan, R.O.C. (Chenghan Huang; Tenghsien Lai) \|\| Silicon Base Development Inc., Science Park, Hsinchu, Taiwan (Chiming Chen) \|\| Department of Automatic Control Engineering, Feng Chia University, Taichung, Taiwan, R.O.C. (Chunming Chang; Chingfu Tsou; Thong-Shing Hwang)
Abstract	This study demonstrated a newly type technology of a wafer level packaging method for light emitting diode (LED) with aspheric lens and microlens array using microelectromechanical systems (MEMS) technology and transfer molding process. The novel packaging structure includes two components: the silicon-based packaging substrate which is formed with arrayed reflector depression and through-hole interconnects by bulk micromachining and the optical encapsulation with lens configuration that formed by transfer molding in wafer level. By this pattern transfer process, the precise alignment between lens configuration and the reflector of silicon substrate can be achieved and batch process can be realized to reduce the costs. Beside, the packaging element can be used more applications. In the study, the pattern transfer of various lens profiles was also accomplished successfully by using silicone gel as lens mold. The brightness of the packaging elements with single aspheric lens profile and high fill factor microlens array can be increased by 26% and 16%, respectively, in comparison to the case of optical encapsulation with smooth curved surface. Furthermore, the light radiation uniformity was improved effectively through 100% fill factor microlens array. Therefore, the structure can satisfy the requirements of wafer level LED packaging and improve the heat dissipation and light extraction efficiency.
Starting Page	84
Ending Page	87
File Size	911434
Page Count	4
File Format	PDF
ISBN	9781457719837
e-ISBN	9781457719820
e-ISBN	9781457719813
DOI	10.1109/EPTC.2011.6184391
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2011-12-07
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Lenses Light emitting diodes Substrates Encapsulation Microoptics Arrays
Content Type	Text
Resource Type	Article

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