NDLI: Post cure behaviour of encapsulants for QFN packages processed by an open-ended single mode resonant microwave applicator

Content Provider	IEEE Xplore Digital Library
Author	Pavuluri, S.K. Desmulliez, M.P.Y. Goussetis, G. Arrighi, V. Johnston, K. Adamietz, R. Tilford, T. Bailey, C.
Copyright Year	2011
Description	Author affiliation: University of Greenwich, School of Computing and Mathematical Sciences, Park Row, London SE10 9LS, UK (Tilford, T.; Bailey, C.) \|\| The Institute of Electronics, Communications and Information Technology (ECIT), Queen's University Belfast, NI Science Park, Queen's Road, Queen's Island, BT3 9DT, United Kingdom (Goussetis, G.) \|\| School of Engineering & Physical Sciences, Department of Chemistry, Heriot-Watt University, Edinburgh EH14 4AS, Scotland, United Kingdom (Arrighi, V.; Johnston, K.) \|\| MIcroSystems Engineering Centre (MISEC), School of Engineering and Physical Sciences, Heriot-Watt University, Edinburgh EH14 4AS, Scotland, United Kingdom (Pavuluri, S.K.; Desmulliez, M.P.Y.) \|\| Fraunhofer Institut für Produktionstechnik und Automatisierung, Stuttgart, Germany (Adamietz, R.)
Abstract	An open-ended single mode resonant microwave applicator has been developed for the curing of encapsulants materials used for microelectronic packaging. Post cure behaviour of Henkel™ E01080 encapsulant material has been studied by Differential Scanning Calorimetry (DSC), Attenuated Total Reflectance Fourier-Transform Infrared (ATR-FTIR) analysis and Dynamic Mechanical Analysis (DMA). DSC based measurement of the microwave cured samples indicates a ∼ 99.2% degree of cure and a glass transition temperature, Tg, of 113°C for a sample cured at 150oC for 90 seconds. For the corresponding convection oven cured sample the degree of cure was found to be approximately 70% for the same duration of cure. The ATR-FTIR analysis showed no significant difference between the conventionally and microwave cured samples. Thermal ageing analysis performed on fully conventional and microwave cured samples showed similar ageing behaviour for both samples at a given temperature under Tg.
Starting Page	573
Ending Page	578
File Size	1001305
Page Count	6
File Format	PDF
ISBN	9781457719837
e-ISBN	9781457719820
e-ISBN	9781457719813
DOI	10.1109/EPTC.2011.6184486
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2011-12-07
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Microwave ovens Electromagnetic heating Microwave theory and techniques Materials Temperature measurement Curing Microwave measurements
Content Type	Text
Resource Type	Article

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