NDLI: Experimental investigation of microgap cooling technology for minimizing temperature gradient and mitigating hotspots in electronic devices

Content Provider	IEEE Xplore Digital Library
Author	Alam, T. Poh Seng Lee Yap, C.R. Liwen Jin
Copyright Year	2011
Description	Author affiliation: Thermal Process Lab 2, Department of Mechanical Engineering, National University of Singapore, Engineering Drive 1, Singapore 117576 (Alam, T.; Poh Seng Lee; Yap, C.R.; Liwen Jin)
Abstract	Hotspots can be generated by non-uniform heat flux condition over the heated surface due to higher packaging densities and greater power consumption of high-performance computing technology in military systems designs. Because of this hotspot within a given chip, local heat generation rate exceed the average value on the chip and increase the peak temperature for a given total power generation which degrades the reliability and performance of equipments. Two phase microgap cooling technology is promising to minimization of temperature gradient and reduction of maximum temperature over the heated surface of the device because of unique boiling mechanism in microgap: confined flow and thin film evaporation. The present study aims to experimentally investigate the applicability of microgap cooling technology for minimizining temperature gradient and mitigating hotspots from the heated surface of electronic device. Experiments are performed in silicon based microgap heat sink having a range of gap dimension from 200 µm – 400 µm. Encouraging results have been obtained using microgap channel cooler for hotspots mitigation as it maintain uniform and low wall temperature over the heated surface.
Starting Page	530
Ending Page	535
File Size	1335412
Page Count	6
File Format	PDF
ISBN	9781457719837
e-ISBN	9781457719820
e-ISBN	9781457719813
DOI	10.1109/EPTC.2011.6184478
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2011-12-07
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Microchannel Temperature sensors Fluctuations Heat sinks Heat transfer Water heating
Content Type	Text
Resource Type	Article

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