NDLI: Reliability of copper wire bonding in humidity environment

Content Provider	IEEE Xplore Digital Library
Author	Hai Liu Zhenqing Zhao Qiang Chen Jianwei Zhou Maohua Du Senyun Kim Jonghyun Chae Myungkee Chung
Copyright Year	2011
Description	Author affiliation: Samsung Semiconductor (China) R&D Co., Ltd, No.15 Jin Ji Hu Road, Suzhou Industrial Park, Jiangsu Province, China (Hai Liu; Zhenqing Zhao; Qiang Chen; Jianwei Zhou; Maohua Du; Senyun Kim; Jonghyun Chae; Myungkee Chung)
Abstract	Copper wire bonding is being developed rapidly in recent years to replace expensive gold wire for electronic packaging. However, one issue about reliability in humidity environment causes risk in its application. The copper wire-aluminum pad interface degradation usually leads to electrical open failure. Present paper studied all the 5 factors including pad finish of chip, molding compound, wire bonding parameters, copper wire type and protective gas type in wire bonding process that affect this issue. Through bond pull test at different stage of uHAST, the influence and significance degree of the factors were obtained. The pad finish was found has the most significant effect. No degradation occurred at copper-gold and copper-palladium interface. For aluminum finish, mold compound and wire bonding parameters have significant effect. Green EMC, high USG and low Search Force in wire bonding process is benefit to enhance reliability of copper wire bonding in humidity environment. Concerning the palladium coated copper wire and bare copper wire, forming protective gas of 5%H2+95%N2 and pure N2, there was no significant effect founded. So for the safe copper wire bonding application, noble metal such as gold and palladium pad finish is the best choice. If the aluminum pad is used, green EMC and optimized wire bonding parameters are necessary to guarantee the reliability.
Starting Page	53
Ending Page	58
File Size	2667431
Page Count	6
File Format	PDF
ISBN	9781457719837
e-ISBN	9781457719820
e-ISBN	9781457719813
DOI	10.1109/EPTC.2011.6184385
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2011-12-07
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Copper Wires Force Bonding Aluminum Palladium Gold
Content Type	Text
Resource Type	Article

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